Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it has settled its patent infringement claim against Elpida Memory Inc., and both Infineon and Elpida have agreed to seek dismissal of all pending patent infringement cases. Infineon initiated proceedings in February 2010, when it filed a complaint against Elpida and Elpida’s customers in the U.S. International Trade Commission (ITC). Elpida subsequently filed two lawsuits ...

Infineon Technologies and Fairchild Semiconductor today announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33™) packages.

Infineon Technologies today introduces the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64mm² (vs. 150mm² for the D2PAK) and a very low profile with only 1mm height (vs. 4.4mm for the D2PAK). The significantly smaller package size, combined with benchmark low parasitic inductances, provides designers with a new and effective way to decrease system solution size in power density drive...

Infineon Technologies and Mitsubishi Electric Corporation agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.

Infineon has advanced to become the world’s foremost supplier of chips for automotive electronics, according to the most recent study published by Strategy Analytics. The U.S.-based market researcher reports that Infineon captured a 9.0 percent share of the global market with sales totaling $US1.31 billion in 2009. Infineon strengthened its market position even though it was a crisis year for the automobile industry, with the overall market for...

Infineon Technologies today announced the availability of its 2nd generation SiC (Silicon Carbide) Schottky diodes in the TO-220 FullPAK package. The new TO220 FullPak portfolio combines the high electrical performance standards of the 2nd generation ThinQ! SiC Schottky diodes with the advantages of a fully isolated package, including easier and more reliable mounting without having to use isolating bushing and foil.

Infineon Technologies today introduced its 600V and 1200V High Speed 3 (3rd generation) IGBT product family optimized for high frequency and hard switching applications. The device family sets a new benchmark in reduced switching losses and best-in-class efficiency and is designed to address topologies switching at up to 100kHz.

Infineon Technologies presents new IGBT modules designed for highest power density and reliability: a PrimePACK™ module with 1400A in 1700V in a PrimePACK 3 packaging, and the new flagship of the EconoDUAL™ family, the EconoDUAL 3 with 600A in 1200V.

Infineon Technologies announced that the Hirose plant of the Toyota Motor Corporation awarded Infineon the ”Honor Quality Award”, its highest level award for delivering extraordinary product quality. This is the first time ever that a non-Japanese company was honored with a “Honor Quality Award” and Infineon is the only recipient of the award in 2010. Infineon was recognized for providing CAN transceivers with zero-defect quality for fou...

At the Embedded World Show 2010 in Nuremberg, Infineon Technologies produced a complete and scalable high-temperature 8-bit microcontroller (MCU) family capable of operating at up to 150 °C ambient temperature, meeting the most rigorous industry standard for use in automotive and industrial electronics application environments. The new XC800 150°C family is specified without limitations for the temperature range from -40 °C up to 150 °C. This...

Infineon Technologies has expanded its cost-effective and scalable XC800 microcontroller (MCU) portfolio with two powerful new device series. The new XC82x and XC83x series were specifically developed to further reduce system cost and allow for improved energy efficiency of a wide range of industrial applications.

Infineon Technologies AG introduces its specific off-line driver IC for high-efficiency LED bulbs with dimming for residential lighting. With a flexible architecture that supports very cost-effective 40W/60W/100W incandescent bulb replacement and all typical consumer lighting applications, the ICL8001G sets a new benchmark with respect to integration, performance, features, and total system cost. The ICL8001G enables up to 90 percent efficiency, ...

Improving the energy efficiency of computing and telecommunications applications, Infineon Technologies AG today at the Applied Power Electronics Conference & Exposition 2010 announced additions to its OptiMOS power MOSFET portfolio. Infineon introduced an OptiMOS 25V device family that is optimized for voltage regulation in power supplies for computer servers and telecommunications / data communications switches. The new MOSFETs are also integra...

Infineon Technologies AG today announced its collaboration with Vodafone Group Plc, the world’s leading mobile telecommunications company.

To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies today launched its new XMM2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous use of two SIMs in the handset, with features like call hold and swap to provide real-time switching facility between both SIMs at the touch of a button. Today there is a high growth rate for Dual-SIM phones in the BRIC (Brazil, Russia, India, a...

Infineon Technologies announced XMM6181, a new entry-level smartphone platform for Android handsets addressing the high volume consumer segment. XMM 6181 offers open OS support for Android through a highly integrated system solution that will help to bring mobile social networking to the mass market. With this extension to its smart devices portfolio, Infineon brings smartphone functionality for a new price segment with wholesale prices between ...

Infineon Technologies announced XMM6181, a new entry-level smartphone platform for Android handsets addressing the high volume consumer segment. XMM 6181 offers open OS support for Android through a highly integrated system solution that will help to bring mobile social networking to the mass market. With this extension to its smart devices portfolio, Infineon brings smartphone functionality for a new price segment with wholesale prices between ...

Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...

Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...

Smart card manufacturers Giesecke & Devrient GmbH (G&D) and Oberthur Technologies S.A., and chip suppliers Infineon Technologies AG and INSIDE Contactless S.A. today announced they have launched an industry initiative to provide a new security solution for next-generation smart card-based public transport applications. The solution will build on an open standard now being implemented by the four partner companies, which will eventually be govern...